Model MS 75x4-L from FHR is a versatile sputtering system designed for deposition of common metals and insulators (i.e. Al, Au, Cr, ITO, Si, SiO2, Si3N4) on samples and substrates (up to a diameter of 4" =100 mm). The system consists of a load-lock chamber and a deposition chamber to preserve high vacuum conditions during deposition. The system can operate in two modes:
- Serial sputtering where multiple-layers can be deposited one on top of the other;
- Co-sputtering mode where one DC target (metals and semiconductors) and one RF target (insulators) can simultaneously be deposited on the substrate. All deposition sequences are fully computer controlled thus allowing multi-layer deposition.